Atomica launches AI Photonic Integration Platform

Atomica, a U.S.-based microfabrication foundry, announced the launch of its AI Photonic Integration Platform, a microfabrication platform for customers developing photonic and heterogeneous AI hardware. The platform supports the integration of optics, electronics, memory, thermal structures and package-level interfaces into compact systems designed for manufacturing.

The launch is the third in Atomica’s series of AI infrastructure platforms, following its AI Optical Connectivity Platform and AI Optical Source Platform. The three platforms address different parts of the AI optical hardware stack, including moving and aligning light, generating and managing optical power, and integrating optical functions with electronics, memory, routing, thermal management and packaging.

AI hardware development increasingly involves challenges related to connecting and packaging different components. As AI systems scale, bandwidth, interconnect density, signal integrity, thermal management, optical alignment and package-level integration are important system considerations.

Atomica’s AI Photonic Integration Platform combines microfabrication technologies for silicon and glass interposers, through-silicon and through-glass vias, redistribution layers, wafer-level packaging, bonding, cavities, optical alignment structures and customer-specific process layers.

The platform is intended for applications including AI accelerators, high-bandwidth memory integration, chiplet packages, data-center switches, optical I/O modules, co-packaged and near-packaged optics, photonic integrated circuit packaging, optical engines, external laser-source packages, advanced sensors and physical-AI hardware.

A central focus of the platform is heterogeneous integration. Photonic, electronic, memory and thermal components may be fabricated on different substrates, use different materials and have different alignment, stress, thermal and reliability requirements. Integrating these elements requires consideration of electrical and optical performance, as well as manufacturing requirements.

The platform provides a development and manufacturing pathway that allows customers to combine existing process modules with custom layers for specific architectures. Customers can move from feasibility studies and prototypes through manufacturing readiness and production.

The AI Photonic Integration Platform works alongside Atomica’s AI Optical Connectivity and AI Optical Source Platforms. The other platforms address the generation, coupling, alignment and routing of light, while the AI Photonic Integration Platform supports the integration of those optical functions with other components at the substrate and package levels.

For more information, visit atomica.com.

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